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1.1.1 Wafer Fabrication

The team will look at defect generation, during (a) Crystallization where optimization and characterisation of Cz-ingots will be crucial to maintain high electronic quality and uniformity as the ingots increase in size and (b) Wafering where wafer breakage, bowing and uniformity of the electronic quality are issues for larger and thinner wafers, both across the surface of a wafer, and from wafer to wafer along the length of an ingot.

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