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2.4.3 Demonstration and Evaluation of (Flexible) Minimodules


   • Demonstrate progress toward minimodule of metal chalcogenide 1.0&2.0 (>=10x10cm2 ) by developing key technologies of monolithic interconnection, largearea uniform absorber and Cd-free buffer deposition.    • Evaluate alternative high throughput and low-cost screening printing of metal contact for further cost-reduction. For conductive steel based flexible minimodules, alternative wafer-like interconnection will be developed.

  • Evaluate long-term stability, life-cycle performance of minimodules.

  • Develop commercialisation pathways towards single junction and tandem cell applications.

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