2.4.3 Demonstration and Evaluation of (Flexible) Minimodules
• Demonstrate progress toward minimodule of metal chalcogenide 1.0&2.0 (>=10x10cm2 ) by developing key technologies of monolithic interconnection, largearea uniform absorber and Cd-free buffer deposition. • Evaluate alternative high throughput and low-cost screening printing of metal contact for further cost-reduction. For conductive steel based flexible minimodules, alternative wafer-like interconnection will be developed.
• Evaluate long-term stability, life-cycle performance of minimodules.
• Develop commercialisation pathways towards single junction and tandem cell applications.