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3.3.4 Low-Cost TCA Interconnected >4” Silicon-Based Tandem Cells

• Further develop novel interconnection using low-cost TCA bonding by adapting this bonding technology for different silicon bottom cells

• Develop optical design database for various combinations of top cells and silicon bottom cells, and demonstrate large area (>4”) processing capability.

• Investigate encapsulation and long-term stability through the collaboration with industry partners (Longi, Jinko).

• Evaluate life cycle performance, cost and commercialisation pathways.

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