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4.3.1 Thermomechanical Stress Modelling


Dr Pei-Chieh Hsiao

Partners 5B (pending confirmation)


• Build on existing research using finite element modelling to adapt cell metallisation patterns and ribbon geometry to minimise the stress induced in wafers during soldering or thermal cycling.

• Use the developed methods to evaluate the stress induced in modules with thinner wafers and new module (e.g., shingled, tiled) and module assembly architectures.

• Seek to work with Suncable and 5B an modelling stress in real-world conditions with their unique design and deployment conditions and locations.

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