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4.1.3 Plated Metallisation for Silicon Tandem Cells


Prof. Anita Ho-Baillie, A/Prof. Ned Ekins-Daukes, Dr Heping Shen


SunDrive Solar


• Investigate processes and optimal interface layers required for copper-plated GaAs top cells

• Develop new processes to replace photolithography for the fabrication of metal contacts on GaAs top cells of silicon tandem devices.
• Demonstrate 45% CPV efficiency on commercial epitaxial wafers, 50% CPV solar cell efficiency on research lab scale devices.

• Development scalable, low-cost metallisation for tandem solar cells

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