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Device Metallisation (PP4.1)

PP4.1: Device Metallisation


This work package will focus on the development and characterisation for device metallisation, with a focus on industrially relevant processes which can enable electrical connection between cells in a module. As such, this stream will complement research being conducted in PP1, PP2 and PP3. Some initial device metallisation activities are described below, however it is expected that new activities will emerge during the lifetime of the ACAP program as metallisation challenges presented by new emerging devices become evident.

PP4.1.1 Advanced Screen Printing

PP4.1.2 Metallisation of Passivated Contact Cells

PP4.1.3 Plated Metallisation for Silicon Tandem Cells

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